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Complex PCB Assembly DetailSMT
- Maximum board size of 20” X 18” (510 X 460mm) utilizing panelization or fixturing we have the capability to manufacture a variety of smaller sizes
- Multi-layer capable with maximum board thickness of .25”
- Smallest component package size of 0201
- 12 mil pitch Quad Flat Pack (QFP)
- BGA – 1600 Ball (BGA / CCGA / Micro BGA)
- Press fit connectors can be mounted
Solder process
- Lead free / Tin-Lead
- No-Clean or RMA
- Wave solder Hitachi OMD PCB test capabilities include:
- Automated optical inspection
- Flying probe
- HP in-circuit programming and test
- LabView functional test stations
- Manual X-Ray
- Custom test fixture development
- Boundary Scan Testing with device programming capability
PCBA Quality
Hitachi OMD’s Quality Assurance organization has assisted in the development of processes and controls to assure the highest possible product quality and reliability. Our current No Defect Ratio is 95% and our final submission yield is >99%. Test Engineering can also provide HALT (Highly Accelerated Lifecycle Testing) and HASS (Highly Accelerated Stress Screen) services to insure the design achieves your quality and product reliability specifications.
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