Complex PCB Assembly

We manufacture complex multi-layer and high parts count PCBAs. Hitachi Design & Engineering services can help improve your complex board layout using DFx and Six Sigma methodologies and ensure they are compliant with the RoHS directive. We will analyze your design, making recommendations when necessary for improved fabrication, assembly, test, serviceability and reliability. And Hitachi OMD’s global network assures availability of the highest quality components and lowest ownership costs. Our capabilities include Surface Mount Technology and Advanced Soldering processes:

Maximum board size of 20” X 18" (510 X 460mm) utilizing paneling or fixturing
Maximum Thickness 0.25”
Smallest component package size of 0201
12 mil pitch Quad Flat Pack (QFP)
BGA – 1600 Ball (BGA/CCGA/MIcro BGA
Mixed technology capability

For more information: PCB Assembly Details

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